データシートサーチシステム |
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AD311 データシート(PDF) 8 Page - RFHIC |
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AD311 データシート(HTML) 8 Page - RFHIC |
8 / 9 page E-pHEMT MMIC AD311 Korean Facilities : 82-31-250-5078 / rfsales@rfhic.com All specifications may change without notice US Facility : 919-677-8780 / sales@rfhicusa.com 8 / 9 Version 1.3 Package Dimensions (Type: QFN3x3) * Unit: mm[inch] | Tolerance: ±0.2[.008] ▲ Top View ▲ Side View ▲ Bottom View Pin Description Pin No Function Pin No Function Pin No Function Pin No Function 1 NC 5 Input Matching 9 NC 13 NC 2 GND 6 NC 10 GND 14 Output-3 3 GND 7 Output-1 11 GND 15 NC 4 Input 8 NC 12 Output-2 16 NC * Mounting Configuration Notes 1. Ground / thermal via holes are critical for the proper performance of this device. 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via hole region contacts the heatsink. 4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink. 5. RF trace width depends upon the PCB material and construction. 6. Use 1 oz. Copper minimum. |
同様の説明 - AD311_14 |
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