SM5S10 thru SM5S36A

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Vishay General Semiconductor

Revision: 14-Sep-11

4

Document Number: 88382

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 5 - Typical Transient Thermal Impedance

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

0.01

0.1

1

10

100

100

10

1

0.1

0.01

t - Pulse Width (s)

DO-218AB

Mounting Pad Layout

0.413 (10.5)

0.374 (9.5)

0.091 (2.3)

0.067 (1.7)

0.116 (3.0)

0.093 (2.4)

0.150 (3.8)

0.126 (3.2)

0.366 (9.3)

0.343 (8.7)

0.606 (15.4)

0.583 (14.8)

0.116 (3.0)

0.093 (2.4)

0.628 (16.0)

0.592 (15.0)

0.539 (13.7)

0.524 (13.3)

0.366 (9.3)

0.343 (8.7)

0.406 (10.3)

0.382 (9.7)

0.342 (8.7)

0.327 (8.3)

0.413 (10.5)

0.374 (9.5)

0.028 (0.7)

0.020 (0.5)

0.138 (3.5)

0.098 (2.5)

Lead 1

0.098 (2.5)

0.059 (1.5)

Lead 2/Metal Heatsink

0.197 (5.0)

0.185 (4.7)

0.016 (0.4) MIN.