Multilayer Chip Varistor for Surge and

ESD Protection – L Type Series

Document No

TMVL-XXOS001D

Issued date

2014/04/18

Page

7/9

TA-I TECHNOLOGY CO., LTD

8.4 Reflow and temperature

8.5 IR reflow Pb Free Process suggestion profile

(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150µm

(2) Ramp-up rate (217℃ to Peak) + 3℃/second max

(3) Temp. maintain at 175 +/-25℃ 180 seconds max

(4) Temp. maintain above 217℃ 60-150 seconds

(5) Peak temperature range 245℃+20℃/-10℃ time within 5℃ of actually peak

temperature (tp) 10~20 seconds

(6) Ramp down rate +6 ℃/second max.

※

Perform adequate test in advance, as the reflow temperature profile will vary according to the conditions of the

manufacturing process, and the specification of the reflow furnace.

8.6 Resistance to soldering heat-High Temperature Resistance:260

℃

,10sec-3times.

8.7 Hand Soldering

In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors

and the tip of soldering iron may cause electrical failures and mechanical damages such as cracking

or breakings of the devices. The soldering shall be carefully controlled and carried out so that the

temperature gradient is kept minimum with following recommended conditions for hand soldering.