9

NE334S01

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different

conditions.

<TYPES OF SURFACE MOUNT DEVICE>

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E)

Soldering process

Soldering conditions

Symbol

Infrared ray reflow

Peak package’s surface temperature: 230

°C or below, Reflow time: 30

seconds or below (210

°C or higher), Number of reflow process: 1,

Exposure limit*: None

IR30-00

Partial heating method

Terminal temperature: 230

°C or below, Flow time: 10 seconds or below,

Exposure limit*: None

*:

Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25

°C and relative humidity at 65 % or less.

Note: Do not apply more than a single process at once, except for “Partial heating method”.

PRECAUTION:

Avoid high static voltage and electric fields, because this device is Hetero Junction field effect transistor

with shottky barrier gate.