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SM6T56CAY データシート(PDF) 8 Page - STMicroelectronics |
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SM6T56CAY データシート(HTML) 8 Page - STMicroelectronics |
8 / 12 page Application and design guidelines SM6TY 8/12 DocID17741 Rev 5 2 Application and design guidelines More information is available in the ST Application note AN2689 “Protection of automotive electronics from electrical hazards, guidelines for design and component selection”. 3 Packaging information • Case: JEDEC DO-214AA molded plastic over planar junction • Terminals: solder plated, solderable as per MIL-STD-750, Method 2026 • Polarity: for unidirectional types the band indicates cathode • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 16. SMB dimensions (definitions) E C L E1 D A1 A2 b |
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