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CD4015BMS データシート(PDF) 8 Page - Intersil Corporation |
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CD4015BMS データシート(HTML) 8 Page - Intersil Corporation |
8 / 8 page 7-96 CD4015BMS Chip Dimensions and Pad Layout FIGURE 8. TYPICAL POWER DISSIPATION AS A FUNCTION OF FREQUENCY Typical Performance Characteristics (Continued) CL = 50pF CL = 15pF AMBIENT TEMPERATURE (TA) = +25 oC SUPPLY VOLTAGE (VDD) = 15V 10V 5V 10V tr, tf = 20ns RL = 200k Ω 1 24 6 8 10 24 6 8 102 24 6 8 103 24 6 8 104 24 6 8 CLOCK INPUT FREQUENCY (fCL) (kHz) 105 10 102 2 8 6 4 103 2 8 6 4 104 2 8 6 4 105 2 8 6 4 Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch) METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches DIE SIZE: X = 80 (77 - 85) = (1.956 - 2.159) Y = 98 (95 - 103) = (2.413 - 2.616) 13 3 14 15 12 11 10 2 1 16 4 5 6 7 8 9 98 80 |
同様の部品番号 - CD4015BMS |
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同様の説明 - CD4015BMS |
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