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CD4041UBMS データシート(PDF) 7 Page - Intersil Corporation |
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CD4041UBMS データシート(HTML) 7 Page - Intersil Corporation |
7 / 7 page 7 Chip Dimensions and Pad Layout FIGURE 10. TYPICAL POWER DISSIPATION vs INPUT RISE AND FALL TIME PER OUTPUT PAIR FIGURE 11. TYPICAL POWER DISSIPATION vs FREQUENCY PER OUTPUT PAIR Typical Performance Characteristics (Continued) AMBIENT TEMPERATURE (TA) = +25 oC 8 6 4 2 INPUT RISE AND FALL TIME (tr, tf) (ns) 10 102 103 104 105 8 6 4 2 10 8 6 4 2 102 8 6 4 2 103 8 6 4 2 104 8 6 4 2 105 8 6 4 2 8 6 4 28 6 4 28 6 4 28 6 4 28 6 4 2 106 107 100kHz AT 15V 10kHz AT 15V 1kHz AT 5V 10kHz AT 5V 100kHz AT 5V 1kHz AT 15V 2 FREQUENCY (f) (Hz) 103 104 8 6 4 8 6 4 2 8 6 4 2 8 6 4 2 8 6 4 2 104 103 102 101 105 AMBIENT TEMPERATURE (TA) = +25 oC CL = 50pF CL = 15pF 8 6 4 2 4 2 2 105 8 6 42 106 8 6 42 107 8 6 4 INPUT tr = tp = 20ns VDD = 15V 10V 5V 5V 3V Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch) 1 14 13 12 11 10 9 87 6 5 4 3 2 METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches DIE SIZE: X = 72 (69 - 77) Y = 82 (79 - 87) CD4041UBMS |
同様の部品番号 - CD4041UBMS |
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同様の説明 - CD4041UBMS |
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