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データシートサーチシステム |
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データシートサーチシステム |
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BTB20-600BW データシート(PDF) 4 Page - Kersemi Electronic Co., Ltd. |
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BTB20-600BW データシート(HTML) 4 Page - Kersemi Electronic Co., Ltd. |
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4 / 5 page  Fig. 3: Correlation between maximum RMS power dissipation and maximum allowable temperatures (Tamb and Tcase) for different thermal resistances heatsink + contact (BTB). Fig. 4: RMS on-state current versus case temper- ature. 1E-3 1E-2 1E-1 1E+0 1E+1 1E +2 5E+2 0.01 0.1 1 Zth/Rth Zth(j-c) Zth(j-a) tp(s) Fig. 5: Relative variation of thermal impedance versus pulse duration. Fig. 6: Relative variation of gate trigger current and holding current versus junction temperature. Fig. 1: Maximum RMS power dissipation versus RMS on-state current (F = 50Hz).(Curves are cut off by (dI/dt)c limitation) Fig. 2: Correlation between maximum RMS power dissipation and maximum allowable temperatures (Tamb and Tcase) for different thermal resistances heatsink + contact (BTA). BTA(B)20 BW/CW 2014-6-10 4 www.kersemi.com |
同様の部品番号 - BTB20-600BW |
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同様の説明 - BTB20-600BW |
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