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BCP56 データシート(PDF) 2 Page - NXP Semiconductors |
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BCP56 データシート(HTML) 2 Page - NXP Semiconductors |
2 / 22 page BCP56_BCX56_BC56PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 9 — 25 October 2011 2 of 22 NXP Semiconductors BCP56; BCX56; BC56PA 80 V, 1 A NPN medium power transistors 2. Pinning information 3. Ordering information [1] Valid for all available selection groups. Table 3. Pinning Pin Description Simplified outline Graphic symbol SOT223 1base 2 collector 3emitter 4 collector SOT89 1emitter 2 collector 3base SOT1061 1base 2emitter 3 collector 13 2 4 sym016 2, 4 3 1 321 sym042 1 2 3 Transparent top view 12 3 sym021 3 2 1 Table 4. Ordering information Type number[1] Package Name Description Version BCP56 SC-73 plastic surface-mounted package with increased heatsink; 4 leads SOT223 BCX56 SC-62 plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89 BC56PA HUSON3 plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 2 0.65 mm SOT1061 |
同様の部品番号 - BCP56_15 |
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同様の説明 - BCP56_15 |
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