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IRLR3410PBF データシート(PDF) 1 Page - International Rectifier

部品番号 IRLR3410PBF
部品情報  Logic Level Gate Drive
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メーカー  IRF [International Rectifier]
ホームページ  http://www.irf.com
Logo IRF - International Rectifier

IRLR3410PBF データシート(HTML) 1 Page - International Rectifier

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IRLR/U3410PbF
HEXFET® Power MOSFET
S
D
G
VDSS = 100V
RDS(on) = 0.105Ω
ID = 17A
Description
12/7/04
Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
17
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
12
A
IDM
Pulsed Drain Current
…
60
PD @TC = 25°C
Power Dissipation
79
W
Linear Derating Factor
0.53
W/°C
VGS
Gate-to-Source Voltage
± 16
V
EAS
Single Pulse Avalanche Energy
‚…
150
mJ
IAR
Avalanche Current
…
9.0
A
EAR
Repetitive Avalanche Energy
…
7.9
mJ
dv/dt
Peak Diode Recovery dv/dt
ƒ
5.0
V/ns
TJ
Operating Junction and
-55 to + 175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
°C
Absolute Maximum Ratings
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case
–––
1.9
RθJA
Junction-to-Ambient (PCB mount) **
–––
50
°C/W
RθJA
Junction-to-Ambient
–––
110
Thermal Resistance
D-PAK
TO-252AA
I-PAK
TO-251AA
l Logic Level Gate Drive
l Ultra Low On-Resistance
l Surface Mount (IRLR3410)
l Straight Lead (IRLU3410)
l Advanced Process Technology
l Fast Switching
l Fully Avalanche Rated
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve the
lowest possible on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient device for use in a wide
variety of applications.
The D-PAK is designed for surface mounting using
vapor phase, infrared, or wave soldering techniques.
The straight lead version (IRFU series) is for through-
hole mounting applications. Power dissipation levels
up to 1.5 watts are possible in typical surface mount
applications.
PD - 95087A
www.irf.com
1
l Lead-Free


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