© 2012 Solid State Optronics • San José, CA

Page 5 of 9

AD4C113/H/S/TR

Rev 2.00 (11/19/2012)

001536

AD4C113

1 Form A / 1 Form B

400V / 35 Ω

MOSFET Output Solid State Relay

Process

Step

Description

Parameter

A

Preheat Start Temperature (ºC)

150ºC

B

Preheat Finish Temperature (ºC)

180ºC

C

Preheat Time (s)

90 - 120s

D

Melting Temperature (ºC)

230ºC

E

Time above Melting Temperature (s)

30s

F

Peak Temperature, at Terminal (ºC)

260ºC

G

Dwell Time at Peak Temperature (s)

10s

H

Cool-down (ºC/s)

<6ºC/s

AD4C113 Solder Temperature Profile Recommendations

(1) Infrared Reflow:

Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow.

Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device

package should not exceed 250ºC:

A

B

C

D

F

E

G

H

(2) Wave Solder:

(3) Hand Solder:

Maximum Temperature:

260ºC

(at terminal)

Maximum Time:

10s

Pre-heating:

100 - 150ºC (30 - 90s)

Single Occurrence

Maximum Temperature:

350ºC

(at tip of soldering iron)

Maximum Time:

3s

Single Occurrence

Figure 1