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TS5A6542 データシート(PDF) 1 Page - Texas Instruments |
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TS5A6542 データシート(HTML) 1 Page - Texas Instruments |
1 / 22 page VIO NC GND NO V+ IN COM GND 2 8 3 4 6 7 1 5 A1 A2 B2 C2 D2 B1 C1 D1 TS5A6542 www.ti.com SCDS211C – AUGUST 2006 – REVISED DECEMBER 2009 0.75- Ω SPDT ANALOG SWITCH WITH INPUT LOGIC TRANSLATION Check for Samples: TS5A6542 1 FEATURES • Specified Break-Before-Make Switching • COM Port to GND • Low ON-State Resistance (0.75 Ω Max) – 8000-V Human-Body Model (A114-B, Class II) • Control Inputs Referenced to VIO – ±15-kV Contact Discharge (IEC 61000-4-2) • Low Charge Injection • Excellent ON-State Resistance Matching APPLICATIONS • Low Total Harmonic Distortion (THD) • Cell Phones • 2.25-V to 5.5-V Power Supply (V+) • PDAs • 1.65-V to 1.95-V Logic Supply (VIO) • Portable Instrumentation • Latch-Up Performance Exceeds 100 mA Per YZP PACKAGE JESD 78, Class II (BOTTOM VIEW) • ESD Performance Tested Per JESD 22 – 4000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) – 400-V Machine Model (A115-A) DESCRIPTION/ORDERING INFORMATION The TS5A6542 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 2.25 V to 5.5 V. The device offers a low ON-state resistance with an excellent channel-to-channel ON-state resistance matching, and the break-before-make feature to prevent signal distorion during the transferring of a signal from one path to another. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications. The TS5A6542 has a separate logic supply pin (VIO) that is characterized to operate from 1.65 V to 1.95 V. VIO powers the control circuitry, which allows the TS5A6542 to be controlled by 1.8-V signals. Table 1. ORDERING INFORMATION(1) TA PACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoFree™ – WCSP (DSBGA) –40°C to 85°C 0.23-mm Large Bump – YZP Tape and reel TS5A6542YZPR _ _ _ JH7 (Pb-free) (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2006–2009, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
同様の部品番号 - TS5A6542_15 |
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同様の説明 - TS5A6542_15 |
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