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LM1084 データシート(PDF) 4 Page - Texas Instruments

部品番号 LM1084
部品情報  LM1084 5-A Low Dropout Positive Regulators
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LM1084 データシート(HTML) 4 Page - Texas Instruments

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LM1084
SNVS037G – SEPTEMBER 1999 – REVISED JANUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Maximum Input to Output Voltage Differential
LM1084-ADJ
29
V
LM1084-3.3
27
V
LM1084-5.0
25
V
Power Dissipation(3)
Internally Limited
Junction Temperature (TJ)
(4)
150
°C
Lead Temperature
260, to 10 sec
°C
Storage temperature, Tstg
–65
150
°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the
test conditions, see the Electrical Characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery.
(4)
The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Junction Temperature Range (TJ)
(2)
Control Section
–40
125
°C
Output Section
–40
150
°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the
test conditions, see the Electrical Characteristics.
(2)
The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations.
6.4 Thermal Information
LM1084
THERMAL METRIC(1)
KTT
NDE
UNIT
3 PINS
3 PINS
RθJA
Junction-to-ambient thermal resistance
40.4
22.7
RθJC(top)
Junction-to-case (top) thermal resistance
42.6
15.5
RθJB
Junction-to-board thermal resistance
23.0
4.1
°C/W
ψJT
Junction-to-top characterization parameter
9.8
2.1
ψJB
Junction-to-board characterization parameter
22.0
4.1
RθJC(bot)
Junction-to-case (bottom) thermal resistance: Control Section/Output
0.65/2.7
0.65/2.7
Section
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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