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LMZ31530 データシート(PDF) 3 Page - Texas Instruments

部品番号 LMZ31530
部品情報  30A SIMPLE SWITCHER짰 Power Module with 3.0V-14.5V Input in QFN Package
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メーカー  TI [Texas Instruments]
ホームページ  http://www.ti.com
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LMZ31530 データシート(HTML) 3 Page - Texas Instruments

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LMZ31530
www.ti.com
SLVSBC7B – OCTOBER 2013 – REVISED DECEMBER 2013
THERMAL INFORMATION
LMZ31530
THERMAL METRIC(1)
RLG
UNIT
72 PINS
θJA
Junction-to-ambient thermal resistance(2)
Natural Convection
8.6
θJA(100LFM)
Junction-to-ambient thermal resistance(3)
100 LFM
7.8
°C/W
ψJT
Junction-to-top characterization parameter(4)
1.6
ψJB
Junction-to-board characterization parameter(5)
4.2
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance,
θJA, applies to devices soldered directly to a 100 mm x 100 mm, 6-layer PCB with 1 oz.
copper and natural convection cooling. Additional airflow reduces
θJA.
(3)
The junction-to-ambient thermal resistance,
θJA, applies to devices soldered directly to a 100 mm x 100 mm, 6-layer PCB with 1 oz.
copper and 100 LFM forced air cooling. Additional airflow reduces
θJA.
(4)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is
the temperature of the top of the device.
(5)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is
the temperature of the board 1mm from the device.
PACKAGE SPECIFICATIONS
LMZ31530
UNIT
Weight
4.96 grams
Flammability
Meets UL 94 V-O
MTBF Calculated reliability
Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign
26.5 MHrs
Copyright © 2013, Texas Instruments Incorporated
3
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