データシートサーチシステム |
|
TMP107BIDR データシート(PDF) 4 Page - Texas Instruments |
|
|
TMP107BIDR データシート(HTML) 4 Page - Texas Instruments |
4 / 40 page TMP107 SBOS716B – MAY 2015 – REVISED SEPTEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, V+ 6 V I/O1, I/O2 –0.3 (V+) + 0.3 Input voltage R1, R2 –0.3 6 V ALERT1, ALERT2 –0.3 6 Sink current ALERT1, ALERT2 10 mA Operating junction –55 150 Temperature °C Storage, Tstg –60 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage, V+ 1.7 3.3 5.5 V Operating free-air temperature, TA –55 125 °C 6.4 Thermal Information TMP107 THERMAL METRIC(1) D (SOIC) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 116.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 62.5 °C/W RθJB Junction-to-board thermal resistance 56.6 °C/W ψJT Junction-to-top characterization parameter 14.6 °C/W ψJB Junction-to-board characterization parameter 56.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: TMP107 |
同様の部品番号 - TMP107BIDR |
|
同様の説明 - TMP107BIDR |
|
|
リンク URL |
プライバシーポリシー |
ALLDATASHEET.JP |
ALLDATASHEETはお客様のビジネスに役立ちますか? [ DONATE ] |
Alldatasheetは | 広告 | お問い合わせ | プライバシーポリシー | リンク交換 | メーカーリスト All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |