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0W888-002-XTP データシート(PDF) 10 Page - ON Semiconductor |
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0W888-002-XTP データシート(HTML) 10 Page - ON Semiconductor |
10 / 30 page BELASIGNA 250 http://onsemi.com 10 Recommended Design Guidelines BELASIGNA 250 is designed to allow both digital and analog processing in a single system. Due to the mixed−signal nature of this system, the careful design of the printed circuit board (PCB) layout is critical to maintain the high audio fidelity of BELASIGNA 250. To avoid coupling noise into the audio signal path, keep the digital traces away from the analog traces. To avoid electrical feedback coupling, isolate the input traces from the output traces. Recommended Ground Design Strategy The ground plane should be partitioned into two: the analog ground plane (AGND) and the digital ground plane (DGND). These two planes should be connected together at a single point, known as the star point. The star point should be located at the ground terminal of a capacitor on the output of the power regulator as illustrated in Figure 1. The DGND plane is used as the ground return for digital circuits and should be placed under digital circuits. The AGND plane should be kept as noise−free as possible. It is used as the ground return for analog circuits and it should surround analog components and pins. It should not be connected to or placed under any noisy circuits such as RF chips, switching supplies or digital pads of BELASIGNA 250 itself. Analog ground returns associated with the audio output stage should connect back to the star point on separate individual traces. For more information on the recommended ground design strategy, see Table 5 and Table 6. In some designs, space constraints may make separate ground planes impractical. In this case a star configuration strategy should be used. Each analog ground return should connect to the star point with separate traces. |
同様の部品番号 - 0W888-002-XTP |
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同様の説明 - 0W888-002-XTP |
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