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8V31012NLGI8 データシート(PDF) 10 Page - Integrated Device Technology |
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8V31012NLGI8 データシート(HTML) 10 Page - Integrated Device Technology |
10 / 17 page 1-TO-12, DIFFERENTIAL HCSL FANOUT BUFFER 10 REVISION 1 10/21/15 8V31012 DATA SHEET EPAD Thermal Release Path In order to maximize both the removal of heat from the package and the electrical performance, a land pattern must be incorporated on the Printed Circuit Board (PCB) within the footprint of the package corresponding to the exposed metal pad or exposed heat slug on the package, as shown in Figure 5. The solderable area on the PCB, as defined by the solder mask, should be at least the same size/shape as the exposed pad/slug area on the package to maximize the thermal/electrical performance. Sufficient clearance should be designed on the PCB between the outer edges of the land pattern and the inner edges of pad pattern for the leads to avoid any shorts. While the land pattern on the PCB provides a means of heat transfer and electrical grounding from the package to the board through a solder joint, thermal vias are necessary to effectively conduct from the surface of the PCB to the ground plane(s). The land pattern must be connected to ground through these vias. The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are application specific and dependent upon the package power dissipation as well as electrical conductivity requirements. Thus, thermal and electrical analysis and/or testing are recommended to determine the minimum number needed. Maximum thermal and electrical performance is achieved when an array of vias is incorporated in the land pattern. It is recommended to use as many vias connected to ground as possible. It is also recommended that the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is desirable to avoid any solder wicking inside the via during the soldering process which may result in voids in solder between the exposed pad/slug and the thermal land. Precautions should be taken to eliminate any solder voids between the exposed heat slug and the land pattern. Note: These recommendations are to be used as a guideline only. For further information, refer to the Application Note on the Surface Mount Assembly of Amkor’s Thermally/Electrically Enhance Leadframe Base Package, Amkor Technology. Figure 5. Assembly for Exposed Pad Thermal Release Path - Side View (drawing not to scale) GROUND PLANE LAND PATTERN SOLDER THERMAL VIA EXPOSED HEAT SLUG (GROUND PAD) PIN PIN PAD SOLDER PIN PIN PAD SOLDER |
同様の部品番号 - 8V31012NLGI8 |
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同様の説明 - 8V31012NLGI8 |
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