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LM4040AIM3-2.5 データシート(PDF) 6 Page - Texas Instruments |
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LM4040AIM3-2.5 データシート(HTML) 6 Page - Texas Instruments |
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6 / 67 page  LM4040-N, LM4040-N-Q1 SNOS633J – OCTOBER 2000 – REVISED AUGUST 2015 www.ti.com 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Industrial Temperature Range –40°C ≤ TA ≤ 85 °C Temperature Range (Tmin ≤ TA ≤ Tmax) Extended Temperature Range –40 ≤ TA ≤ 125°C °C LM4040-N-2.0 60 15 μA to mA LM4040-N-2.5 60 15 μA to mA LM4040-N-3.0 62 15 μA to mA Reverse Current LM4040-N-4.1 68 15 μA to mA LM4040-N-5.0 74 15 μA to mA LM4040-N-8.2 91 15 μA to mA LM4040-N-10.0 100 15 μA to mA (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), RθJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4040-N, TJmax = 125°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package, and 180°C/W with 0.4 ″ lead length and 170°C/W with 0.125″ lead length for the TO-92 package and 415°C/W for the SC70 package. 6.4 Thermal Information LM4040-N/LM4040-N-Q1 THERMAL METRIC(1) DBZ (SOT-23) LP (TO-92) DCK (SC70) UNIT 3 PINS 3 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 291.9 166 267 °C/W RθJC(top) Junction-to-case (top) thermal resistance 114.3 88.2 95.6 °C/W RθJB Junction-to-board thermal resistance 62.3 145.2 48.1 °C/W ψJT Junction-to-top characterization parameter 7.4 32.5 2.4 °C/W ψJB Junction-to-board characterization parameter 61 N/A 47.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: LM4040-N LM4040-N-Q1 |
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