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ADC0802LCWM データシート(PDF) 4 Page - Texas Instruments

部品番号 ADC0802LCWM
部品情報  Analog-to-Digital Converters
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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ADC0802LCWM データシート(HTML) 4 Page - Texas Instruments

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ADC0801, ADC0802, ADC0803, ADC0804, ADC0805
SNOSBI1C – NOVEMBER 2009 – REVISED JUNE 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Supply voltage (VCC)
(3)
6.5
V
Logic control inputs
–0.3
18
Voltage
V
At other input and outputs
–0.3
(VCC +0.3)
Dual-In-Line Package (plastic
260
Lead Temperature
Dual-In-Line Package (ceramic)
300
(Soldering, 10
Surface Mount Package Vapor Phase (60 seconds)
215
°C
seconds)
Infrared (15 seconds)
220
Storage Temperature
–65
150
Package Dissipation at TA = 25°C
875
mW
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, contact the Sales Office/Distributors for availability and specifications.
(3)
A Zener diode exists, internally, from VCC to GND and has a typical breakdown voltage of 7 VDC.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±800
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
4.5
5
5.5
V
Analog Input Voltage
GND – 0.05
VCC + 0.05
VDC
6.4 Thermal Information
ADC080x
ADC0802,
ADC0804
THERMAL METRIC(1)
UNIT
NFH (PDIP)
DW (SOIC)
20 PINS
20 PINS
RθJA
Junction-to-ambient thermal resistance
38.5
63.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
23.4
27.2
°C/W
RθJB
Junction-to-board thermal resistance
19.5
31.8
°C/W
ψJT
Junction-to-top characterization parameter
8.7
5.7
°C/W
ψJB
Junction-to-board characterization parameter
19.4
31.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: ADC0801 ADC0802 ADC0803 ADC0804 ADC0805


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