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TL16C752CI-Q1 データシート(PDF) 6 Page - Texas Instruments |
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TL16C752CI-Q1 データシート(HTML) 6 Page - Texas Instruments |
6 / 57 page 6 TL16C752CI-Q1 SLLSEQ9A – OCTOBER 2015 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: TL16C752CI-Q1 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Pin Functions (continued) PIN TYPE DESCRIPTION NAME NO. RTSA 33 O Request to send (active low). These outputs are associated with individual UART channels A and B. A low on the RTS pins indicates the transmitter has data ready and waiting to send. Writing a 1 in the modem control register (MCR[1]) sets these pins to low, indicating data is available. After a reset, these pins are set to 1. These pins only affect the transmit and receive operation when auto-RTS function is enabled through the enhanced feature register (EFR[6]), for hardware flow control operation. RTSB 22 RXA 5 I Receive data input. These inputs are associated with individual serial channel data to the TL16C752CI-Q1 device. During the local loopback mode, these RX input pins are disabled and TX data is internally connected to the UART RX input internally. During normal mode, RXn should be held high when no data is being received. These inputs also can be used in IrDA mode. For more information, see IrDA Overview. RXB 4 RXRDYA 31 O Receive ready (active low). RXRDYA and RXRDYB go low when the trigger level has been reached or a timeout interrupt occurs. They go high when the RX FIFO is empty or there is an error in RX FIFO. RXRDYB 18 TXA 7 O Transmit data. These outputs are associated with individual serial transmit channel data from the TL16C752CI-Q1 device. During the local loopback mode, the TX input pin is disabled and TX data is internally connected to the UART RX input. TXB 8 TXRDYA 43 O Transmit ready (active low). TXRDYA and TXRDYB go low when there are a trigger level number of spares available. They go high when the TX buffer is full. TXRDYB 6 VCC 42 PWR Power supply inputs XTAL1 13 I Crystal or external clock input. XTAL1 functions as a crystal input or as an external clock input. A crystal can be connected between XTAL1 and XTAL2 to form an internal oscillator circuit. Alternatively, an external clock can be connected to XTAL1 to provide custom data rates. XTAL2 14 O Output of the crystal oscillator or buffered clock. See also XTAL1. XTAL2 is used as a crystal oscillator output or buffered clock output. (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage –0.5 6 V VI Input voltage –0.5 VCC + 0.5 V VO Output voltage –0.5 VCC + 0.5 V TA Operating free-air temperature –40 105 °C Tstg Storage temperature –65 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 ±1000 |
同様の部品番号 - TL16C752CI-Q1 |
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同様の説明 - TL16C752CI-Q1 |
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