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M02006E-DIE データシート(PDF) 11 Page - M/A-COM Technology Solutions, Inc. |
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M02006E-DIE データシート(HTML) 11 Page - M/A-COM Technology Solutions, Inc. |
11 / 16 page M02006 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: http://www.macom.com/support 11 CMOS Pre-amplifier with AGC for Long-reach 155 Mbps Fiber-optics Based Transmitter Rev V4 4.3 Layout Considerations Use good high-frequency design and layout techniques, taking care to bypass VCC over the frequencies to several hundred MHz. When using die, take care to minimise bond-wire length, especially for the PIN A and Gnd pads. A typical TO-can assembly is shown in Figure 4-3. Figure 4-3. Typical TO-can Assembly Gnd V CC D OUT D OUT 47 0pF |
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