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CD4069UBNSR データシート(PDF) 4 Page - Texas Instruments

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部品番号 CD4069UBNSR
部品情報  CMOS Hex Inverter
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CD4069UBNSR データシート(HTML) 4 Page - Texas Instruments

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CD4069UB
SCHS054D – NOVEMBER 1998 – REVISED FEBRUARY 2016
www.ti.com
Product Folder Links: CD4069UB
Submit Documentation Feedback
Copyright © 1998–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
During soldering at distance 1/16 inch ± 1/32 inch (1.59 mm ± 0.79 mm) from case for 10 s maximum
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VDD
DC supply-voltage (voltages referenced to VSS terminal)
–0.5
20
V
VI
Input voltage, all inputs
–0.5 to VDD
0.5
V
IIK
DC input current, any one input
–10
10
mA
PD
Power dissipation per package
–55°C to 100°C
500
mW
100°C to 125°C
12
200
Device dissipation per output transistor
Full range (all package types)
100
mW
Lead temperature(2)
265
°C
TJ
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±500
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±200
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VDD
Supply voltage
3
18
V
TA
Operating temperature
–55
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
CD4069UB
UNIT
D (SOIC)
J (CDIP)
N (PDIP)
NS (SO)
PW (TSSOP)
14 PINS
14 PINS
14 PINS
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
94.9
57.9
91.2
122.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
56.4
28.5
45.5
48.8
50.8
°C/W
RθJB
Junction-to-board thermal resistance
49.2
37.7
50
63.8
°C/W
ψJT
Junction-to-top characterization parameter
21.1
30.6
15
6.3
°C/W
ψJB
Junction-to-board characterization parameter
48.9
37.6
49.6
63.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
N/A
N/A
N/A
°C/W


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