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LM10502 データシート(PDF) 5 Page - Texas Instruments

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部品番号 LM10502
部品情報  Dual Buck LDO Power Management Unit
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI1 - Texas Instruments

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LM10502
www.ti.com
SNVS884B – AUGUST 2012 – REVISED MAY 2013
Operating Ratings
(1) (2) (3)
VIN_B1, VIN_B2_VIN_B3, VIN
3.0V to 5.5V
VIN_IO
1.72V to 3.63V and < VVIN
All pins except VIN_IO
0V to VVIN
Junction Temperature (TJ)
−30°C to 125°C
Ambient Temperature (TA)
−30°C to 85°C
Junction-to-Ambient Thermal Resistance (
θJA)
(1)
42.1°C/W
Maximum Continuous Power Dissipation (PD-MAX)
(1)
0.95W
(1)
In applications where high power dissipation and/or poor thermal resistance is present the maximum ambient temperature may have to
be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = +125°C),
the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
(2)
The amount of Absolute Maximum power dissipation allowed for the device depends on the ambient temperature and can be calculated
using the formula: P = (TJ–TA)/θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-
ambient thermal resistance.
θJA is highly application and board-layout dependent. Internal thermal shutdown circuitry protects the device
from permanent damage. (See General Electrical Characteristics.)
(3)
Internal thermal shutdown protects device from permanent damage. Thermal shutdown engages at TJ = +140°C and disengages at TJ =
+120°C (typ.). Thermal shutdown is ensured by design.
General Electrical Characteristics
(1) (2)
Unless otherwise noted, VVIN = 5.0V, VVIN_IO = 3.0V.
The application circuit used is the one shown in "Typical Application Circuit."
Limits in standard typeface are for T,= 25°C.
Limits appearing in boldface type apply over the entire operating junction temperature range of
−30°C ≤ TA = TJ ≤ +85°C.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Quiescent Supply
BUCK1 OFF, BUCK2 PFM
IQ
60
130
µA
Current
no load,LDO SLEEP
UNDER/OVERVOLTAGE LOCK OUT
VUVLO_RISING
2.75
2.9
3.05
Under Voltage Lock
Out
VUVLO_FALLING
2.45
2.6
2.75
V
VOVLO_RISING
5.7
Over Voltage Lock
Out
VOVLO_FALLING
5.6
DIGITAL INTERFACE
Input Supply for digital
VVIN_IO
VVIN_IO ≤ V VIN
1.72
3.63
interface
VIL
Logic input low
0.3*VVIN_IO
SPI_CS, SPI_DI, SPI_CLK,
V
RESET,
VIH
Logic input high
0.7*VVIV_IO
VOL
Logic output low
0.2*VVIN_IO
SPI_DO
VOH
Logic output high
0.8*VVIN_IO
SPI_CS, SPI_DI, SPI_CLK,
−2
µA
Input current, pin
IIL
driven low
RESET
−5
Input current, pin
SPI_CS, SPI_DI, SPI_CLK,
IIH
2
µA
driven high
RESET
fSPI_MAX
SPI max frequency
10
MHz
Minimum high-pulse
tRESET
2
µsec
width (3)
(1)
All limits are ensured by design, test and/or statistical analysis. All electrical characteristics having room-temperature limits are tested
during production with TJ = 25°C. All hot and cold limits are ensured by correlating the electrical characteristics to process and
temperature variations and applying statistical process control.
(2)
Capacitors: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) are used in setting electrical characteristics.
(3)
Specification ensured by design. Not tested during production.
Copyright © 2012–2013, Texas Instruments Incorporated
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