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LM10502 データシート(PDF) 5 Page - Texas Instruments |
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LM10502 データシート(HTML) 5 Page - Texas Instruments |
5 / 35 page LM10502 www.ti.com SNVS884B – AUGUST 2012 – REVISED MAY 2013 Operating Ratings (1) (2) (3) VIN_B1, VIN_B2_VIN_B3, VIN 3.0V to 5.5V VIN_IO 1.72V to 3.63V and < VVIN All pins except VIN_IO 0V to VVIN Junction Temperature (TJ) −30°C to 125°C Ambient Temperature (TA) −30°C to 85°C Junction-to-Ambient Thermal Resistance ( θJA) (1) 42.1°C/W Maximum Continuous Power Dissipation (PD-MAX) (1) 0.95W (1) In applications where high power dissipation and/or poor thermal resistance is present the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = +125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). (2) The amount of Absolute Maximum power dissipation allowed for the device depends on the ambient temperature and can be calculated using the formula: P = (TJ–TA)/θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to- ambient thermal resistance. θJA is highly application and board-layout dependent. Internal thermal shutdown circuitry protects the device from permanent damage. (See General Electrical Characteristics.) (3) Internal thermal shutdown protects device from permanent damage. Thermal shutdown engages at TJ = +140°C and disengages at TJ = +120°C (typ.). Thermal shutdown is ensured by design. General Electrical Characteristics (1) (2) Unless otherwise noted, VVIN = 5.0V, VVIN_IO = 3.0V. The application circuit used is the one shown in "Typical Application Circuit." Limits in standard typeface are for T,= 25°C. Limits appearing in boldface type apply over the entire operating junction temperature range of −30°C ≤ TA = TJ ≤ +85°C. Symbol Parameter Conditions Min Typ Max Units Quiescent Supply BUCK1 OFF, BUCK2 PFM IQ 60 130 µA Current no load,LDO SLEEP UNDER/OVERVOLTAGE LOCK OUT VUVLO_RISING 2.75 2.9 3.05 Under Voltage Lock Out VUVLO_FALLING 2.45 2.6 2.75 V VOVLO_RISING 5.7 Over Voltage Lock Out VOVLO_FALLING 5.6 DIGITAL INTERFACE Input Supply for digital VVIN_IO VVIN_IO ≤ V VIN 1.72 3.63 interface VIL Logic input low 0.3*VVIN_IO SPI_CS, SPI_DI, SPI_CLK, V RESET, VIH Logic input high 0.7*VVIV_IO VOL Logic output low 0.2*VVIN_IO SPI_DO VOH Logic output high 0.8*VVIN_IO SPI_CS, SPI_DI, SPI_CLK, −2 µA Input current, pin IIL driven low RESET −5 Input current, pin SPI_CS, SPI_DI, SPI_CLK, IIH 2 µA driven high RESET fSPI_MAX SPI max frequency 10 MHz Minimum high-pulse tRESET 2 µsec width (3) (1) All limits are ensured by design, test and/or statistical analysis. All electrical characteristics having room-temperature limits are tested during production with TJ = 25°C. All hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical process control. (2) Capacitors: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) are used in setting electrical characteristics. (3) Specification ensured by design. Not tested during production. Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM10502 |
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