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LM10692RMYT データシート(PDF) 6 Page - Texas Instruments

部品番号 LM10692RMYT
部品情報  LM10692 Power Management Unit for SandForce SF3700 SSD Controllers
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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LM10692RMYT データシート(HTML) 6 Page - Texas Instruments

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LM10692
SNVSA53 – JULY 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
(1) (2) (3) (4)
over operating free-air temperature range (unless otherwise noted)
(5)
MIN
MAX
UNIT
Any supply pin, VIN to GND
-0.3
6
V
Any signal pin
-0.3
+(VIN+0.3)V but
V
not over 6.0V
(1)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2)
All voltages are measured with respect to the potential at the GND pins.
(3)
VIN refers to these power pins connected together: VIN_B1 = VIN_B2=VI_B3 = VIN_B4 = VIN_B5 = VIN_B6 = VIN
(4)
GND Pins means all ground pins must be connected together.
(5)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
-65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
2000
V
pins(1)
V(ESD)
Electrostatic discharge
Charged device model (CDM), per JEDEC specification
1000
V
JESD22-C101, all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
(1) (2) (3) (4)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VIN, VIN_B2, VIN_B3, VIN_B4, VIN_B5
2.5
5.5
V
VIN_B1, VIN_B6
2.5
4
V
Junction Temperature, TJ
-40
125
°C
Ambient Temperature, TA
-40
85
°C
Storage Temperature
-65
150
°C
(1)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2)
All voltages are measured with respect to the potential at the GND pins.
(3)
VIN refers to these power pins connected together: VIN_B1 = VIN_B2=VI_B3 = VIN_B4 = VIN_B5 = VIN_B6 = VIN
(4)
GND Pins means all ground pins must be connected together.
7.4 Thermal Information
LM10692
THERMAL METRIC(1)
RMY
UNIT
36 PINS
RθJA
Junction-to-ambient thermal resistance
39.2
RθJC(top)
Junction-to-case (top) thermal resistance
9.8
RθJB
Junction-to-board thermal resistance
6.2
°C/W
ψJT
Junction-to-top characterization parameter
0.1
ψJB
Junction-to-board characterization parameter
6.2
RθJC(bot)
Junction-to-case (bottom) thermal resistance
2.6
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6
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Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: LM10692


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