データシートサーチシステム |
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LM2574 データシート(PDF) 4 Page - Texas Instruments |
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LM2574 データシート(HTML) 4 Page - Texas Instruments |
4 / 38 page 4 LM2574, LM2574HV SNVS104D – JUNE 1999 – REVISED APRIL 2016 www.ti.com Product Folder Links: LM2574 LM2574HV Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Maximum supply voltage LM2574 4.5 V LM2574HV 63 ON/OFF pin input voltage –0.3 VIN V Output voltage to ground, steady-state –1 V Power dissipation Internally limited Lead temperature, soldering (10 s) 260 °C Maximum junction temperature 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage LM2574 40 V LM2574HV 60 TJ Temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The package thermal impedance is calculated in accordance with JESD 51-7. (3) Thermal resistances were simulated on a 4-layer, JEDEC board. 6.4 Thermal Information THERMAL METRIC(1)(2) LM2574, LM2574HV UNIT P (PDIP) NPA (SOIC) 8 PINS 14 PINS RθJA Junction-to-ambient thermal resistance(3) 60.4 77.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance (3) 59.9 29.2 °C/W RθJB Junction-to-board thermal resistance(3) 37.9 33.3 °C/W ψJT Junction-to-top characterization parameter 17.1 2 °C/W ψJB Junction-to-board characterization parameter 37.7 32.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance (3) — — °C/W |
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同様の説明 - LM2574 |
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