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MC100EPT622MNR4G データシート(PDF) 4 Page - ON Semiconductor |
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MC100EPT622MNR4G データシート(HTML) 4 Page - ON Semiconductor |
4 / 8 page MC100EPT622 http://onsemi.com 4 Table 5. PECL INPUT DC CHARACTERISTICS VCC = 3.3 V, GND= 0.0 V, TA = −40°C to 85°C Symbol Characteristic Condition Min Typ Max Unit IIH Input HIGH Current VIN= 2420 mV 150 mA IIL Input LOW Current VIN= 1490 mV 200 mA VIH Input HIGH Voltage 2075 2420 mV VIL Input LOW Voltage 1490 1675 mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Table 6. PECL OUTPUT DC CHARACTERISTICS VCC = 3.3 V, GND = 0.0 V (Note 1) Symbol Characteristic −40°C 25°C 85°C Unit Min Typ Max Min Typ Max Min Typ Max IEE Power Supply Current 85 115 145 90 120 155 95 130 155 mA VOH Output High Voltage (Note 2) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV VOL Output Low Voltage (Note 2) 1355 1520 1700 1355 1520 1700 1355 1520 1700 mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. 2. All loading with 50 W to VCC−2.0 V. Table 7. AC CHARACTERISTICS VCC = 3.0 V to 3.8 V (Note 3) Symbol Characteristic −40°C 25°C 85°C Unit Min Typ Max Min Typ Max Min Typ Max fmax Maximum Frequency (See Figure 4) 1.0 1.5 1.0 1.5 1.0 1.5 GHz tPLH, tPHL Propagation Delay to Output (Figure 5, Note 4) D to Q ENPECL to Q ENTTL to Q 100 150 300 450 500 450 800 875 800 100 150 300 500 500 500 875 875 800 100 200 300 500 550 500 800 925 800 ps tJITTER Random Clock Jitter (RMS) (See Figure 4) 0.7 3.0 0.7 3.0 0.7 3.0 ps tr / tf Output Rise/Fall Times (20% − 80%) 100 200 450 100 200 250 100 200 300 ps TSKEW Duty Cycle Skew (Note 5) D to Q Channel 0−7 Channel 8−9 ENPECL to Q ENTTL to Q 120 200 120 100 375 775 400 275 120 200 120 100 375 775 400 275 120 200 120 100 375 775 400 275 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Measured using a 2.4 V source, 50% duty cycle clock source. All loading with 50 W to VCC−2.0 V. 4. 1.5 V to 50% point of the output. 5. Duty cycle skew |tPLH − tPHL| on the specific path. |
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