MC100LVEP34

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11

PACKAGE DIMENSIONS

SOIC−16

CASE 751B−05

ISSUE K

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL CONDITION.

18

16

9

SEATING

PLANE

F

J

M

_

G

8 PL

P

−B−

−A−

M

0.25 (0.010)

−T−

D

K

C

16 PL

S

B

M

0.25 (0.010)

T

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

9.80

10.00

0.386

0.393

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.054

0.068

D

0.35

0.49

0.014

0.019

F

0.40

1.25

0.016

0.049

G

1.27 BSC

0.050 BSC

J

0.19

0.25

0.008

0.009

K

0.10

0.25

0.004

0.009

M

0

7

0

7

P

5.80

6.20

0.229

0.244

R

0.25

0.50

0.010

0.019

____

6.40

16X

0.58

16X

1.12

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT*

16

89

8X

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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