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7440650022 データシート(PDF) 4 Page - Texas Instruments |
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7440650022 データシート(HTML) 4 Page - Texas Instruments |
4 / 40 page 4 LM53602, LM53603 SNVSAR0 – NOVEMBER 2016 www.ti.com Product Folder Links: LM53602 LM53603 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Pin Functions (continued) PIN I/O(1) DESCRIPTION NO. NAME 15, 16 PGND G Power ground to internal low-side MOSFET. Connect to AGND and system ground. Connect pins 15 and 16 directly together at the PCB. 17 EP G Exposed die attach paddle. Connect to ground plane for adequate heat sinking and noise reduction. (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Values given are D.C. (2) A maximum of 42 V can be sustained at this pin for a duration of ≤ 500 ms at a duty cycle of ≤ 0.01%. (3) Transients on this pin, not exceeding –3 V or +40 V, can be tolerated for a duration of ≤ 100 ns. For transients between 40 V and 42 V, see note (2). (4) Positive current flows into this pin. (5) A transient voltage of ±2 V can be sustained for ≤1 µs. 7 Specifications 7.1 Absolute Maximum Ratings over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted) (1) PARAMETER MIN MAX UNIT VIN to AGND, PGND(2) –0.3 40 V SW to AGND, PGND(3) –0.3 VIN + 0.3 V CBOOT to SW –0.3 3.6 V EN to AGND, PGND(2) –0.3 40 V BIAS to AGND, PGND –0.3 16 V FB to AGND, PGND : fixed 5 V and 3.3 V –0.3 16 V FB to AGND, PGND : ADJ –0.3 5.5 V RESET to AGND, PGND –0.3 8 V SYNC, FPWM, to AGND, PGND –0.3 5.5 V VCC to AGND, PGND –0.3 4.2 V RESET pin current(4) –0.1 1.2 mA AGND to PGND(5) –0.3 0.3 V Storage temperature, Tstg –40 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS- 001(1) Pins 1, 2, 3, 12, 13, ±1500 V Pins 11, 5, 8, 9, 6, 7, 4 ±2500 Charged-device model (CDM), per JEDEC specification JESD22-C101(2) Pins 3, 4, 5, 6, 7, 11, 12 and 13 ±750 Pins 1, 2, 8, 9, 15 and 16 ±500 |
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同様の説明 - 7440650022 |
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