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MB85R4M2TFN-G データシート(PDF) 18 Page - Fujitsu Component Limited. |
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MB85R4M2TFN-G データシート(HTML) 18 Page - Fujitsu Component Limited. |
18 / 23 page 18 DS501-00024-4v0-E MB85R4M2T PACKAGE DIMENSIONS 44-pin plastic TSOP Lead pitch Package width × package length 10.16 × 18.41mm Lead shape Sealing method Mounting height Weight 0.46 g (FPT-44P-M34) Dimensions in mm. Note : The values in parentheses are reference values. 0.8mm Gullwing Plastic mold 1.2mm 44-pin plastic TSOP (FPT-44P-M34) 2013 FUJITSU SEMICONDUCTOR LIMITED F44025S-c-2-3 Note 1) # : Resin protrusion.(Each side:+0.15 Max). Note 2) * : These dimensions do not include resin protrusion. Note3)Pins width and pins thickness include plating thickness. Note4)Pins width do not include tie bar cutting remainder. [44] [23] LEAD No. [1] [22] INDEX # 18.41±0.10 (0.805) 0.80TYP 0.30 +0.10 –0.05 0.35 +0.10 –0.05 0.10 MAX 0.125 +0.075 –0.035 0.25TYP 0 ~8° |
同様の部品番号 - MB85R4M2TFN-G |
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同様の説明 - MB85R4M2TFN-G |
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