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MB85R1001ANC-GE1 データシート(PDF) 12 Page - Fujitsu Component Limited. |
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MB85R1001ANC-GE1 データシート(HTML) 12 Page - Fujitsu Component Limited. |
12 / 16 page MB85R1001A 12 DS501-00003-1v0-E ■ PACKAGE DIMENSIONS Please check the latest package dimension at the following URL. http://edevice.fujitsu.com/package/en-search/ 48-pin plastic TSOP Lead pitch 0.50 mm Package width × package length 12.00 mm × 12.40 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.20 mm MAX Weight 0.36 g 48-pin plastic TSOP (FPT-48P-M48) (FPT-48P-M48) C 2010 FUJITSU SEMICONDUCTOR LIMITED F48048Sc-1-1 14.00±0.20(.551±.008) #12.00±0.10 0.10±0.05 (.004±.002) (.472±.004) 0.08(.003) 0.50(.020) 0.22 (.009 ) 1 25 24 48 A 0.145 (.006 ) M 0.10(.004) Details of A part 0~8 (.024±.006) 0.60±0.15 INDEX (STAND OFF) *12.40±0.10(.488±.004) +0.05 –0.03 +.002 –.001 +.002 –.002 +0.05 –0.04 1.13±0.07 (.044±.003) (MOUNTING HEIGHT) 0.25(.010) Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) # : Resin protrusion. (Each side : +0.15 (.006) Max). Note 2) * : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. |
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同様の説明 - MB85R1001ANC-GE1 |
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