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LRC-LRF3WLF-01 データシート(PDF) 2 Page - TT Electronics. |
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LRC-LRF3WLF-01 データシート(HTML) 2 Page - TT Electronics. |
2 / 3 page Low Value 3W Chip Resistors LRF3W Series Low Value 3W Chip Resistors LRF3W Series © Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com 04.10 Welwyn Components 85 Performance Data Construction Patented non-noble copper based thick film material, overglaze and organic protection are screen printed on a 96% alumina substrate. The components are laser trimmed to achieve the required resistance tolerance. Terminations The wrap-around terminations have an electroplated nickel barrier and matte tin finish, this ensures excellent ‘leach’ resistance properties and solderability. Chips can withstand immersion in solder at 250°C for 90 seconds and are suitable for reflow or wave soldering mounting applications. Marking The body protection and marking are resistant to all normal industrial cleaning solvents suitable for printed circuits. Chips are packed and mounted with marking side up. The LRF3W Chips are mounted with the actual resistor element mounted face down on its termination pads. Packaging LRF3W Resistors are supplied taped and reeled as per IEC 286-3. The standard quantity per reel is 1800 parts. Notes: 1. Full AEC-Q200 qualification applies to ohmic values ≥R02. Tape dimensions in mm W P1 P0 P2 D0 D1 E F A0 B0 K0 T T1 T2 ±0.3 ±0.1 ±0.1 ±0.05 ±0.1 ±0.2 ±0.1 ±0.05 ±0.1 ±0.1 ±0.1 ±0.05 nom ±0.15 LRF3W 12 8 4 2 1.5 1.5 1.75 5.5 3.61 6.96 1.17 0.28 0.06 1.45 2.5 ± 0.5 13 ± 0.5 33 ± 1.0 Marking (Both sides) 0.8 ± 0.15 13 ± 0.5mm P1 A0 D1 D0 P0 P2 T2 T1 K0 T AEC-Q200 Table 7 Method Max. (add R05) Typ. (@R20) ref Test 3 High Temp. Exposure MIL-STD-202 Method 108 R% 0.5 0.2 4 Temperature Cycling JESD22 Method JA-104 R% 0.25 0.1 6 Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2 7 Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.2 8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 1 0.5 14 Vibration MIL-STD-202 Method 204 R% 0.5 0.05 15 Resistance to Soldering Heat MIL-STD-202 Method 210 R% 0.25 0.05 16 Thermal Shock MIL-STD-202 Method 107 R% 0.25 0.1 18 Solderability J-STD-002 >95% coverage 21 Board Flex AEC-Q200-005 R% 0.5 0.2 22 Terminal Strength AEC-Q200-006 R% 0.25 0.1 Short Term Overload 6.25 x Pr for 2s R% 0.5 Low Temperature Storage -65°C for 100 hours R% 0.5 Shelf Life Test Room temp for 12 months R% 0.1 Leach Resistance Solder dip at 250°C 90s minimum 0 20 40 60 80 100 0 20 40 60 80 100 120 140 160 Ambient Temperature (°C) Temperature Derating Thermal Data 10 100 100 1000 PCB Copper Area per Termination (mm2) Temperature Rise 1W 3W 2W 09.16 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronicsresistors.com BI Technologies IRC Welwyn |
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同様の説明 - LRC-LRF3WLF-01 |
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