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XEC24P3-30G データシート(PDF) 13 Page - Anaren Microwave

部品番号 XEC24P3-30G
部品情報  Production Friendly
Download  19 Pages
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メーカー  ANAREN [Anaren Microwave]
ホームページ  http://www.anaren.com
Logo ANAREN - Anaren Microwave

XEC24P3-30G データシート(HTML) 13 Page - Anaren Microwave

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Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Model XEC24P3-30G
Rev B
)
(
log
10
)
(
)
(
)
(
)
(
10
dB
P
P
P
P
P
IL
RL
out
ISO
out
DC
out
CPL
out
in
therm
(4)
In terms of S-parameters, ILtherm can be computed as follows:
)
(
log
10
2
41
2
31
2
21
2
11
10
dB
S
S
S
S
IL
therm
(5)
The thermal resistance and power dissipated within the unit are then used to calculate the average total input power
of the unit. The average total steady state input power (Pin) therefore is:
)
(
10
1
10
1
10
10
W
R
T
P
P
therm
therm
IL
IL
dis
in




(6)
Where the temperature delta is the circuit temperature (Tcirc) minus the mounting interface temperature (Tmnt):
)
( C
T
T
T
o
mnt
circ
(7)
The maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit.
Multiple material combinations and bonding techniques are used within the Xinger product family to optimize RF
performance.
Consequently the maximum allowable circuit temperature varies.
Please note that the circuit
temperature is not a function of the Xinger case (top surface) temperature. Therefore, the case temperature cannot
be used as a boundary condition for power handling calculations.
Due to the numerous board materials and mounting configurations used in specific customer configurations, it is the
end users responsibility to ensure that the Xinger coupler mounting interface temperature is maintained within the
limits defined on the power derating plots for the required average power handling. Additionally appropriate solder
composition is required to prevent reflow or fatigue failure at the RF ports. Finally, reliability is improved when the
mounting interface and RF port temperatures are kept to a minimum.
The power-derating curve illustrates how changes in the mounting interface temperature result in converse changes
of the power handling of the coupler.
.


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