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XEC24P3-30G データシート(PDF) 13 Page - Anaren Microwave |
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XEC24P3-30G データシート(HTML) 13 Page - Anaren Microwave |
13 / 19 page Available on Tape and Reel for Pick and Place Manufacturing. USA/Canada: Toll Free: Europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 Model XEC24P3-30G Rev B ) ( log 10 ) ( ) ( ) ( ) ( 10 dB P P P P P IL RL out ISO out DC out CPL out in therm (4) In terms of S-parameters, ILtherm can be computed as follows: ) ( log 10 2 41 2 31 2 21 2 11 10 dB S S S S IL therm (5) The thermal resistance and power dissipated within the unit are then used to calculate the average total input power of the unit. The average total steady state input power (Pin) therefore is: ) ( 10 1 10 1 10 10 W R T P P therm therm IL IL dis in (6) Where the temperature delta is the circuit temperature (Tcirc) minus the mounting interface temperature (Tmnt): ) ( C T T T o mnt circ (7) The maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit. Multiple material combinations and bonding techniques are used within the Xinger product family to optimize RF performance. Consequently the maximum allowable circuit temperature varies. Please note that the circuit temperature is not a function of the Xinger case (top surface) temperature. Therefore, the case temperature cannot be used as a boundary condition for power handling calculations. Due to the numerous board materials and mounting configurations used in specific customer configurations, it is the end users responsibility to ensure that the Xinger coupler mounting interface temperature is maintained within the limits defined on the power derating plots for the required average power handling. Additionally appropriate solder composition is required to prevent reflow or fatigue failure at the RF ports. Finally, reliability is improved when the mounting interface and RF port temperatures are kept to a minimum. The power-derating curve illustrates how changes in the mounting interface temperature result in converse changes of the power handling of the coupler. . |
同様の部品番号 - XEC24P3-30G |
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同様の説明 - XEC24P3-30G |
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