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RT9737 データシート(PDF) 6 Page - Richtek Technology Corporation |
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RT9737 データシート(HTML) 6 Page - Richtek Technology Corporation |
6 / 7 page RT9737 Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation www.richtek.com DS9737-00 February 2014 6 Application Information RT9737 is a 5V high quality low-voltage double-pole double-throw (DPDT) analog switch. RT9737 supply voltage is designed to operate from 2.5 to 5.5V. Supply voltage can be smaller than input voltage while keeping 5V input range. With 70m turn-on resistance, power- loss and signal distortion can be minimized. RT9737 is ideal for switching audio signal from outputs of audio amplifiers. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another for audio applications. Analog Input RT9737 internal topology design for input and output voltage level can greater than supply voltage. Low turn-on resistance and excellent channel to channel matching are ideal for audio applications. Switch Logic Control RT9737 can use SEL pin to control internal switches position for another audio source application. SEL pin input current is very low. Thermal Considerations For continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula : PD(MAX) = (TJ(MAX) TA) / JA where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and JA is the junction to ambient thermal resistance. For recommended operating condition specifications, the maximum junction temperature is 125 C. The junction to ambient thermal resistance, JA, is layout dependent. For WL-CSP-9B 1.24x1.24 (BSC) packages, the thermal resistance, JA, is 78.1C/W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at TA = 25C can be calculated by the following formula : PD(MAX) = (125C 25C) / (78.1C/W) = 1.28W for WL-CSP-9B 1.24x1.24 (BSC) package The maximum power dissipation depends on the operating ambient temperature for fixed TJ(MAX) and thermal resistance, JA. The derating curve in Figure 1 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. Figure 1. Derating Curve of Maximum Power Dissipation INA1 INA2 INB1 OUTB INB2 OUTA GND A1 A2 A3 B3 B1 C1 C2 C3 B2 GND Place the capacitor CVDDEN as close as possible to the VDDEN. Use blind hole to connect other strong ground plane. CVDDEN Figure 2. PCB Layout Guide Four-Layer PCB |
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同様の説明 - RT9737 |
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