データシートサーチシステム |
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LMK60E2-125M データシート(PDF) 10 Page - Texas Instruments |
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LMK60E2-125M データシート(HTML) 10 Page - Texas Instruments |
10 / 19 page 10 LMK60E2-100M, LMK60E2-125M, LMK60E2-156M, LMK60E0-156M LMK60E0-212M, LMK60I2-100M, LMK60I2-322M SNAS718C – DECEMBER 2016 – REVISED DECEMBER 2017 www.ti.com Product Folder Links: LMK60E2-100M LMK60E2-125M LMK60E2-156M LMK60E0-156M LMK60E0-212M LMK60I2- 100M LMK60I2-322M Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated Layout Guidelines (continued) Figure 9. LMK60EX Layout Recommendation for Power Supply and Ground 9.1.3 Recommended Solder Reflow Profile TI recommends following the recommendations of the solder paste supplier to optimize flux activity and to achieve proper melting temperatures of the alloy within the guidelines of J-STD-20. Processing the LMK60EX to be processed with the lowest peak temperature possible while also remaining below the components peak temperature rating as listed on the MSL label is preferred. The exact temperature profile would depend on several factors including maximum peak temperature for the component as rated on the MSL label, board thickness, PCB material type, PCB geometries, component locations, sizes, densities within PCB, as well as the recommended soldering profile from the manufacturer and capability of the reflow equipment to as confirmed by the SMT assembly operation. |
同様の部品番号 - LMK60E2-125M |
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同様の説明 - LMK60E2-125M |
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