5

TS5USBC41

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SCDS377 – MARCH 2018

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report.

6.4 Thermal Information

Device

UNIT

YFF

12 PINS

Junction-to-ambient thermal resistance

91.8

°C/W

Junction-to-case (top) thermal resistance

0.8

°C/W

Junction-to-board thermal resistance

22.8

°C/W

Junction-to-top characterization parameter

0.5

°C/W

Junction-to-board characterization parameter

23.0

°C/W

6.5 Electrical Characteristics

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY

Power supply voltage

2.3

5.5

V

Icc

Active supply current

OE = 0 V

10

22

µA

Supply current during OVP condition

OE = 0 V

15

35

μA

Standby powered down supply

current

SEL1 = 0 V, 1.8 V, or VCC

SEL2 = 0 V, 1.8 V, or VCC

2.2

6

µA

DC Characteristics

ON-state resistance

Refer to ON-State Resistance Figure

5.6

9

Ω

ON-state resistance match between

channels

Refer to ON-State Resistance Figure

0.07

0.3

Ω

ON-state resistance flatness

Refer to ON-State Resistance Figure

0.07

0.4

Ω

I/O pin OFF leakage current

Refer to Off Leakage Figure

-1

1

2

µA

Refer to Off Leakage Figure

-1

150

180

µA

ON leakage current

Refer to On Leakage Figure

-1

1

2

µA

Digital Characteristics

Input logic high

SEL1, SEL2, OE

1.4

V

Input logic low

SEL1, SEL2, OE

0.5

V

Output logic low

FLT

0.4

V

Input high leakage current

-1

1

5

μA

Input low leakage current

SEL1, SEL2, OE = 0 V

-1

±0.2

5

μA