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TLV74233PDQNR データシート(PDF) 4 Page - Texas Instruments

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部品番号 TLV74233PDQNR
部品情報  200-mA, Small Size, Low-Dropout Linear Voltage Regulator
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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4
TLV742P
SBVS323 – SEPTEMBER 2017
www.ti.com
Product Folder Links: TLV742P
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2)
All voltages are with respect to GND pin.
6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Voltage(2)
IN
–0.3
6
V
EN
–0.3
6
V
OUT
–0.3
6
V
Current (source)
OUT
Internally limited
Output short-circuit duration
Indefinite
Operating junction, TJ
–55
150
°C
Storage, Tstg
–55
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM) QSS 009-105 (JESD22-A114A)(1)
±2000
V
Charged device model (CDM) QSS 009-147 (JESD22-C101B.01)(2)
±500
6.3 Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN
Input voltage
2
5.5
V
IOUT
Output current
0
200
mA
TJ
Operating junction temperature range
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
TLV742P
UNIT
DQN (X2SON)
4 PINS
RθJA
Junction-to-ambient thermal resistance
180.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
152
°C/W
RθJB
Junction-to-board thermal resistance
117.2
°C/W
ψJT
Junction-to-top characterization parameter
5.1
°C/W
ψJB
Junction-to-board characterization parameter
117
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
99.7
°C/W


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