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NCV8537 データシート(PDF) 4 Page - ON Semiconductor

部品番号 NCV8537
部品情報  High Accuracy Low Dropout Linear Regulator
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メーカー  ONSEMI [ON Semiconductor]
ホームページ  http://www.onsemi.com
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NCV8537 データシート(HTML) 4 Page - ON Semiconductor

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NCV8537
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PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Description
1, 2
Vout
Regulated output voltage. Bypass to ground with Cout w 1.0 mF
3
SENSE/ADJ
For output voltage sensing, connect to Pins 1 and 2.at Fixed output Voltage version
Adjustable pin at Adjustable output version
4
GND
Power Supply Ground
5
PWRG
Power Good
6
NC
Not Connected
7
NR
Noise Reduction Pin. This is an optional pin used to further reduce noise.
8
SD
Shutdown pin. When not in use, this pin should be connected to the input pin.
9, 10
Vin
Power Supply Input Voltage
EPAD
EPAD
Exposed thermal pad should be connected to ground.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage
Vin
−0.3 to +16
V
Output Voltage
Vout
−0.3 to Vin +0.3 or 10 V*
V
PWRG Pin Voltage
VPWRG
−0.3 to +16
V
Shutdown Pin Voltage
Vsh
−0.3 to +16
V
Junction Temperature Range
TJ
−40 to +150
°C
Storage Temperature Range
Tstg
−50 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
NOTE:
This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) tested per AEC−Q100−002 (EIA/JESD22−A114)
Machine Model (MM) tested per AEC−Q100−003 (EIA/JESD22−A115)
Charged Device Model (CDM) tested per EIA/JESD22−C101.
*Which ever is less. Reverse bias protection feature valid only if (Vout − Vin) ≤ 7 V.
THERMAL CHARACTERISTICS
Characteristic
Test Conditions (Typical Value)
Unit
Min Pad Board (Note 1)
1
, Pad Board (Note 1)
Junction−to−Air,
qJA
215
66
°C/W
Junction−to−Pin, J−L4
58
18
°C/W
1. As mounted on a 35 x 35 x 1.5 mm FR4 Substrate, with a single layer of a specified copper area of 2 oz (0.07 mm thick) copper traces and
heat spreading area. JEDEC 51 specifications for a low and high conductivity test board recommend a 2 oz copper thickness. Test conditions
are under natural convection or zero air flow.


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