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LTM4653 データシート(PDF) 18 Page - Linear Technology

部品番号 LTM4653
部品情報  EN55022B Compliant 58V, 4A Step-Down DC/DC 關Module Regulator
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メーカー  LINER [Linear Technology]
ホームページ  http://www.linear.com
Logo LINER - Linear Technology

LTM4653 データシート(HTML) 18 Page - Linear Technology

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LTM4653
18
Rev 0
For more information www.analog.com
APPLICATIONS INFORMATION
Depending on the duty cycle of operation, the output volt-
age ripple achieved by paralleled, synchronized LTM4653
modules may be considerably smaller than what is yielded
by a single-phase solution. Application Note 77 provides
a detailed explanation of multiphase operation (relevant
to parallel LTM4653 applications) pertaining to noise
reduction and output and input ripple current cancella-
tion. Regardless of ripple current cancellation, it remains
importantfortheoutputcapacitanceofparalleledLTM4653
applications to be designed for loop stability and transient
response. LTpowerCAD is available for such analysis.
Figure 3 illustrates the RMS ripple current reduction as
a function of the number of interleaved (paralleled and
synchronized) LTM4653 modules—derived from Ap-
plication Note 77.
Radiated EMI Noise
The generation of radiated EMI noise is an inherent disad-
vantageofswitchingregulators.Fastswitchingturn-onand
turn-off of the power MOSFETs—necessary for achieving
high efficiency—create high-frequency (~30MHz+) ∆l/∆t
changes within DC/DC converters. This activity tends to
be the dominant source of high-frequency EMI radiation
in such systems. The high level of device integration
within LTM4653—including optimized gate-driver and
critical front-end � filter inductor—delivers low radiated
EMI noise performance. Figures 4 to 6 show typical ex-
amples of LTM4653 meeting the radiated emission limits
established by EN55022 Class B.
Thermal Considerations and Output Current Derating
The thermal resistances reported in the Pin Configuration
section of this data sheet are consistent with those pa-
rameters defined by JESD51-12 and are intended for use
with finite element analysis (FEA) software modeling tools
that leverage the outcome of thermal modeling, simula-
tion, and correlation to hardware evaluation performed on
a µModule package mounted to a hardware test board.
The motivation for providing these thermal coefficients is
found in JESD51-12 (“Guidelines for Reporting and Using
Electronic Package Thermal Information”).
Manydesignersmayopttouselaboratoryequipmentanda
testvehiclesuchasthedemoboardtopredicttheµModule
regulator’s thermal performance in their application at
various electrical and environmental operating conditions
to compliment any FEA activities. Without FEA software,
the thermal resistances reported in the Pin Configuration
section are, in and of themselves, not relevant to providing
guidance of thermal performance; instead, the derating
curves provided in this data sheet can be used in a man-
ner that yields insight and guidance pertaining to one’s
application-usage,andcanbeadaptedtocorrelatethermal
performance to one’s own application.
The Pin Configuration section gives four thermal coeffi-
cients explicitly defined in JESD51-12; these coefficients
are quoted or paraphrased below:
1. θJA, the thermal resistance from junction to ambient, is
the natural convection junction-to-ambient air thermal
resistance measured in a one cubic foot sealed enclo-
sure. This environment is sometimes referred to as
“still air” although natural convection causes the air to
move. This value is determined with the part mounted
toaJESD51-9definedtestboard,whichdoesnotreflect
an actual application or viable operating condition.
2. θJCbottom, the thermal resistance from junction to the
bottom of the product case, is determined with all of
the component power dissipation flowing through the
bottom of the package. In the typical µModule regulator,
the bulk of the heat flows out the bottom of the pack-
age, but there is always heat flow out into the ambient
environment. As a result, this thermal resistance value
may be useful for comparing packages but the test
conditions don’t generally match the user’s application.
3. θJCtop, the thermal resistance from junction to top of
the product case, is determined with nearly all of the
componentpowerdissipationflowingthroughthetopof
the package. As the electrical connections of the typical
µModule regulator are on the bottom of the package, it
is rare for an application to operate such that most of
the heat flows from the junction to the top of the part.
As in the case of θJCbottom, this value may be useful
for comparing packages but the test conditions don’t
generally match the user’s application.


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