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FAN3100C データシート(PDF) 19 Page - ON Semiconductor |
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FAN3100C データシート(HTML) 19 Page - ON Semiconductor |
19 / 21 page www.onsemi.com 19 Physical Dimensions TOP VIEW 0.05 C 0.05 C 2X 2X 2.0 2.0 PIN#1 IDENT A B SIDE VIEW RECOMMENDED LAND PATTERN BOTTOM VIEW SEATING PLANE 1 3 4 6 4 6 3 1 PIN #1 IDENT 0.65 1.30 1.21 0.52(6X) 0.90 0.42(6X) 0.65 2.25 1.68 (0.40) (0.70) NOTES: A. PACKAGE DOES NOT FULLY CONFORM TO JEDEC MO-229 REGISTRATION B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009. D. LAND PATTERN RECOMMENDATION IS EXISTING INDUSTRY LAND PATTERN. E. DRAWING FILENAME: MKT-MLP06Krev5. 2.00±0.05 1.40±0.05 0.80±0.05 (0.20)4X 0.32±0.05 0.10 C A B 0.05 C 0.30±0.05 (6X) (6X) (0.60) 0.08 C 0.10 C 0.75±0.05 0.025±0.025 C 0.20±0.05 1.72 0.15 Figure 53. 2x2 mm , 6-Lead, Molded Leadless Package (MLP) Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact an ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms and conditions, specifically the warranty therein, which covers ON Semiconductor products. |
同様の部品番号 - FAN3100C |
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同様の説明 - FAN3100C |
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