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FAN3100C データシート(PDF) 2 Page - ON Semiconductor

部品番号 FAN3100C
部品情報  Single 2 A High-Speed, Low-Side Gate Driver
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メーカー  ONSEMI [ON Semiconductor]
ホームページ  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

FAN3100C データシート(HTML) 2 Page - ON Semiconductor

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Figure 1. 6-Lead MLP (Top View )
Figure 2. SOT23-5 (Top View )
Ordering Information
Part Number
Input
Threshold
Package
Packing Method
Quantity / Reel
FAN3100CMPX
CMOS
6-Lead, 2x2 mm MLP
Tape & Reel
3000
FAN3100CSX
CMOS
5-Pin, SOT23
Tape & Reel
3000
FAN3100TMPX
TTL
6-Lead, 2x2 mm MLP
Tape & Reel
3000
FAN3100TSX
TTL
5-Pin, SOT23
Tape & Reel
3000
Package Outlines
1
6
5
2
4
3
IN+
AGND
VDD
IN
PGND
OUT
1
2
3
5
4
VDD
GND
IN+
IN
OUT
Figure 3. 6-Lead MLP (Top View )
Figure 4. SOT23-5 (Top View )
Thermal Characteristics
(1)
Package
Θ
JL
(2)
Θ
JT
(3)
Θ
JA
(4)
Ψ
JB
(5)
Ψ
JT
(6)
Units
6-Lead, 2x2 mm Molded Leadless Package (MLP)
2.7
133
58
2.8
42
°C/W
SOT23-5
56
99
157
51
5
°C/W
Notes:
1.
Estimates derived from thermal simulation; actual values depend on the application.
2.
Theta_JL (
Θ
JL): Thermal resistance betw een the semiconductor junction and the bottom surf ace of all the leads
(including any thermal pad) that are typically soldered to a PCB.
3.
Theta_JT (
Θ
JT ): Thermal resistance betw een the semiconductor junction and the top surf ace of the package,
assuming it is held at a uniform temperature by a top-side heatsink.
4.
Theta_JA (
Θ
JA): Thermal resistance betw een junction and ambient, dependent on the PCB design, heat sinking, and
airflow . The value given is for natural convection w ith no heatsink using a 2SP2 board, as specified in JEDEC
standards JESD51-2, JESD51-5, and JESD51-7, as appropriate.
5.
Psi_JB (
Ψ
JB): Thermal characterization parameter providing correlation betw een semiconductor junction temperature
and an application circuit board reference point for the thermal environment defined in Note 4. For the MLP-6
package, the board reference is defined as the PCB copper connected to the thermal pad and protruding from either
end of the package. For the SOT23-5 package, the board reference is defined as the PCB copper adjacent to pin 2.
6.
Psi_JT (
Ψ
JT ): Thermal characterization parameter providing correlation betw een the semiconductor junction
temperature and the center of the top of the package for the thermal environment defined in Note 4.


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