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FAN3100C データシート(PDF) 2 Page - ON Semiconductor |
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FAN3100C データシート(HTML) 2 Page - ON Semiconductor |
2 / 21 page www.onsemi.com 2 Figure 1. 6-Lead MLP (Top View ) Figure 2. SOT23-5 (Top View ) Ordering Information Part Number Input Threshold Package Packing Method Quantity / Reel FAN3100CMPX CMOS 6-Lead, 2x2 mm MLP Tape & Reel 3000 FAN3100CSX CMOS 5-Pin, SOT23 Tape & Reel 3000 FAN3100TMPX TTL 6-Lead, 2x2 mm MLP Tape & Reel 3000 FAN3100TSX TTL 5-Pin, SOT23 Tape & Reel 3000 Package Outlines 1 6 5 2 4 3 IN+ AGND VDD IN − PGND OUT 1 2 3 5 4 VDD GND IN+ IN − OUT Figure 3. 6-Lead MLP (Top View ) Figure 4. SOT23-5 (Top View ) Thermal Characteristics (1) Package Θ JL (2) Θ JT (3) Θ JA (4) Ψ JB (5) Ψ JT (6) Units 6-Lead, 2x2 mm Molded Leadless Package (MLP) 2.7 133 58 2.8 42 °C/W SOT23-5 56 99 157 51 5 °C/W Notes: 1. Estimates derived from thermal simulation; actual values depend on the application. 2. Theta_JL ( Θ JL): Thermal resistance betw een the semiconductor junction and the bottom surf ace of all the leads (including any thermal pad) that are typically soldered to a PCB. 3. Theta_JT ( Θ JT ): Thermal resistance betw een the semiconductor junction and the top surf ace of the package, assuming it is held at a uniform temperature by a top-side heatsink. 4. Theta_JA ( Θ JA): Thermal resistance betw een junction and ambient, dependent on the PCB design, heat sinking, and airflow . The value given is for natural convection w ith no heatsink using a 2SP2 board, as specified in JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate. 5. Psi_JB ( Ψ JB): Thermal characterization parameter providing correlation betw een semiconductor junction temperature and an application circuit board reference point for the thermal environment defined in Note 4. For the MLP-6 package, the board reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the SOT23-5 package, the board reference is defined as the PCB copper adjacent to pin 2. 6. Psi_JT ( Ψ JT ): Thermal characterization parameter providing correlation betw een the semiconductor junction temperature and the center of the top of the package for the thermal environment defined in Note 4. |
同様の部品番号 - FAN3100C |
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同様の説明 - FAN3100C |
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