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FAN3226 データシート(PDF) 24 Page - ON Semiconductor |
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FAN3226 データシート(HTML) 24 Page - ON Semiconductor |
24 / 26 page www.onsemi.com 24 Physical Dimensions B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER A. CONFORMS TO JEDEC REGISTRATION MO-229, VARIATION VEEC, DATED 11/2001 ASME Y14.5M, 1994 RECOMMENDED LAND PATTERN 0.05 0.00 2X 2X 0.8 MAX SEATING PLANE D. FILENAME: MKT-MLP08Drev2 Figure 58. 3x3 mm , 8-Lead Molded Leadless Package (MLP) Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact an ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms and conditions, specifically the warranty therein, which covers ON Semiconductor products. |
同様の部品番号 - FAN3226 |
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同様の説明 - FAN3226 |
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