2011-07-12

8

DRAFT – For Reference only.

Subject to change.

Version 1.0

SFH 9500

Reflow Soldering Profile

Reflow-Lötprofil

Preconditioning: JEDEC Level 1 acc. to JEDEC J-STD-020D.01

0

0

s

OHA04525

50

100

150

200

250

300

50

100

150

200

250

300

t

T

˚C

S

t

t

P

t

T

p

240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

OHA04612

Profile Feature

Profil-Charakteristik

25 °C

to 150 °C

2

3

K/s

Time t

S

T

t

S

t

L

t

P

T

L

T

P

100

120

60

10

20

30

80

100

217

2

3

245

260

3

6

Time

25 °C

to T

P

Time within 5 °C of the specified peak

temperature T

Ramp-down rate*

T

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation

DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

T

Liquidus temperature

Peak temperature

Time above liquidus temperature

Symbol

Symbol

Unit

Einheit

Pb-Free (SnAgCu) Assembly

Minimum

Maximum

Recommendation

K/s

K/s

s

s

s

s

°C

°C

480