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K65P169M180SF5V2 データシート(PDF) 4 Page - NXP Semiconductors

部品番号 K65P169M180SF5V2
部品情報  Kinetis K65 Sub-Family
Download  90 Pages
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メーカー  NXP [NXP Semiconductors]
ホームページ  http://www.nxp.com
Logo NXP - NXP Semiconductors

K65P169M180SF5V2 データシート(HTML) 4 Page - NXP Semiconductors

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Table of Contents
1 Ratings.................................................................................... 5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings.......................................................5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................7
2.2.1
Voltage and current operating requirements.....7
2.2.2
LVD and POR operating requirements............. 8
2.2.3
Voltage and current operating behaviors.......... 9
2.2.4
Power mode transition operating behaviors......10
2.2.5
Power consumption operating behaviors.......... 12
2.2.6
EMC radiated emissions operating behaviors...16
2.2.7
Designing with radiated emissions in mind....... 17
2.2.8
Capacitance attributes...................................... 17
2.3 Switching specifications...................................................17
2.3.1
Device clock specifications............................... 17
2.3.2
General switching specifications....................... 18
2.4 Thermal specifications.....................................................19
2.4.1
Thermal operating requirements....................... 19
2.4.2
Thermal attributes............................................. 19
3 Peripheral operating requirements and behaviors.................. 20
3.1 Core modules.................................................................. 21
3.1.1
Debug trace timing specifications..................... 21
3.1.2
JTAG electricals................................................ 21
3.2 System modules.............................................................. 24
3.3 Clock modules................................................................. 24
3.3.1
MCG specifications........................................... 24
3.3.2
IRC48M specifications...................................... 27
3.3.3
Oscillator electrical specifications..................... 28
3.3.4
32 kHz oscillator electrical characteristics.........31
3.4 Memories and memory interfaces................................... 31
3.4.1
Flash (FTFE) electrical specifications............... 31
3.4.2
EzPort switching specifications......................... 36
3.4.3
Flexbus switching specifications....................... 37
3.4.4
SDRAM controller specifications.......................40
3.5 Security and integrity modules........................................ 43
3.6 Analog............................................................................. 43
3.6.1
ADC electrical specifications.............................43
3.6.2
CMP and 6-bit DAC electrical specifications.....48
3.6.3
12-bit DAC electrical characteristics................. 50
3.6.4
Voltage reference electrical specifications........ 53
3.7 Timers..............................................................................54
3.8 Communication interfaces............................................... 54
3.8.1
Ethernet switching specifications...................... 55
3.8.2
USB Voltage Regulator Electrical
Specifications.................................................... 58
3.8.3
USB Full Speed Transceiver and High Speed
PHY specifications............................................ 59
3.8.4
USB DCD electrical specifications.................... 60
3.8.5
CAN switching specifications............................ 60
3.8.6
DSPI switching specifications (limited voltage
range)................................................................60
3.8.7
DSPI switching specifications (full voltage
range)................................................................62
3.8.8
Inter-Integrated Circuit Interface (I2C) timing....64
3.8.9
UART switching specifications.......................... 65
3.8.10
Low Power UART switching specifications....... 65
3.8.11
SDHC specifications......................................... 66
3.8.12
I2S switching specifications.............................. 67
3.9 Human-machine interfaces (HMI)....................................73
3.9.1
TSI electrical specifications...............................73
4 Dimensions............................................................................. 73
4.1 Obtaining package dimensions....................................... 73
5 Pinout...................................................................................... 74
5.1 K65_169BGA Signal Multiplexing and Pin Assignments.74
5.2 Recommended connection for unused analog and
digital pins........................................................................81
5.3 K65 Pinouts..................................................................... 83
6 Ordering parts......................................................................... 84
6.1 Determining valid orderable parts....................................84
7 Part identification.....................................................................85
7.1 Description.......................................................................85
7.2 Format............................................................................. 85
7.3 Fields............................................................................... 85
7.4 Example...........................................................................86
8 Terminology and guidelines.................................................... 86
8.1 Definitions........................................................................86
8.2 Examples.........................................................................87
8.3 Typical-value conditions.................................................. 87
8.4 Relationship between ratings and operating
requirements....................................................................88
8.5 Guidelines for ratings and operating requirements..........88
9 Revision History...................................................................... 89
4
Kinetis K65 Sub-Family, Rev. 4, 04/2017
NXP Semiconductors


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