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NBSG16BA データシート(PDF) 9 Page - ON Semiconductor |
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NBSG16BA データシート(HTML) 9 Page - ON Semiconductor |
9 / 10 page NBSG16 http://onsemi.com 9 PACKAGE DIMENSIONS FCBGA-16 BA SUFFIX PLASTIC 4 X 4 (mm) BGA FLIP CHIP PACKAGE CASE 489-01 ISSUE O 0.20 LASER MARK FOR PIN 1 IDENTIFICATION IN THIS AREA D E M A1 A2 A 0.10 Z 0.15 Z ROTATED 90 CLOCKWISE DETAIL K _ 5 VIEW M-M e 3 X S M X 0.15 Y Z 0.08 Z 3 b 16 X FEDUCIAL FOR PIN A1 IDENTIFICATION IN THIS AREA 43 21 A B C D 4 16 X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO DATUM PLANE Z. 4. DATUM Z (SEATING PLANE) IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5. PARALLELISM MEASUREMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. DIM MIN MAX MILLIMETERS A 1.40 MAX A1 0.25 0.35 A2 1.20 REF b 0.30 0.50 D 4.00 BSC E 4.00 BSC e 1.00 BSC S 0.50 BSC K -X- -Y- M M -Z- |
同様の部品番号 - NBSG16BA |
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同様の説明 - NBSG16BA |
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