5

ISO224

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

ISO224x

UNIT

DWV (SOIC)

8 PINS

Junction-to-ambient thermal resistance

96.3

°C/W

Junction-to-case (top) thermal resistance

36.9

°C/W

Junction-to-board thermal resistance

60.1

°C/W

Junction-to-top characterization parameter

16.9

°C/W

Junction-to-board characterization parameter

58.2

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

See the Electrical Characteristics table for maximum supply current specifications.

7.5 Power Ratings

(1)

PARAMETER

TEST CONDITIONS

VALUE

UNIT

Maximum power dissipation (both sides)

VDD1 = 18 V, VDD2 = 5.5 V

217

mW

VDD1 = VDD2 = 5.5 V

104.5

Maximum power dissipation (high-side supply)

VDD1 = 18 V

162

mW

VDD1 = 5.5 V

49.5

mW

Maximum power dissipation (low-side supply)

VDD2 = 5.5 V

55

mW