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© ANPEC Electronics Corp.

Rev . A. 3 - Nov . , 2 0 1 7

APX9 1 5 0

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Or de r ing a n d M a rk ing I nfor m a t ion

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

APX9150

Package Code

CE : TSOT-23-6F

Operating Ambient Temperature Range

I : -40 to 105 ℃

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

APX9150 CE :

X50X

The last X is referred as Date Code

Assembly Material

Handling Code

Temperature Range

Package Code

Symbol

Param eter

Rating

Unit

VDD Pin S upply Vo ltage (VDD to GND)

-0 .3 to 7

V

Output P in (OUT1, OUT2) O utp ut Voltage

-0 .3 to 7

V

Output P in (OUT1, OUT2) Maximum Output Current –Continu ous

Hold

500

1000

mA

FG/RD P in Output Sink Current

20

mA

FG/RD P in Output Voltage

-0 .3 to 7

V

Maximum Junction Temp erature

150

Storag e Temp erature

-65 to 15 0

Maximum Lea d Soldering Temperature , 10 Seconds

260

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

The rm a l Ch ar a ct er ist ics

S ymbol

P arame ter

Typical Va lue

Unit

Thermal Resistance-Junction to Am bient

(N ote 2)

TSO T-23-6F

240

TSO T-23-6F

520

mW

Note 2 : The maximum allowable power dissipation at any T

Exceeding the maximum allowable power dissipation will result in excessive die temperature.