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Rev . A. 5 - Aug. , 2 0 1 7

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Cla ssifica t ion Re flow Pr ofile s ( Con t .)

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)

Package

Thickness

Volume mm

3

<350

Volume mm

3

≥350

<2.5 mm

235

°C

220

°C

≥2.5 mm

220

°C

220

°C

Table 2. Pb-free Process – Classification Temperatures (Tc)

Package

Thickness

Volume mm

3

<350

Volume mm

3

350-2000

Volume mm

3

>2000

<1.6 mm

260

°C

260

°C

260

°C

1.6 mm – 2.5 mm

260

°C

250

°C

245

°C

≥2.5 mm

250

°C

245

°C

245

°C

Test item

Method

Description

SOLDERABILITY

JESD-22, B102

5 Sec, 245

°C

HOLT

JESD-22, A108

°C

PCT

JESD-22, A102

168 Hrs, 100

%RH, 2atm, 121°C

TCT

JESD-22, A104

500 Cycles, -65

°C~150°C

HBM

MIL-STD-883-3015.7

VHBM≧2KV

MM

JESD-22, A115

VMM≧200V

Latch-Up

JESD 78

Re lia bilit y Te st Pr og r a m

Cust om e r Ser vice

Anpec Electronics Corp.

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