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ISD1700A データシート(PDF) 27 Page - Winbond

部品番号 ISD1700A
部品情報  Multi-Message Single-Chip Voice Record&Playback Devices
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メーカー  WINBOND [Winbond]
ホームページ  http://www.winbond.com
Logo WINBOND - Winbond

ISD1700A データシート(HTML) 27 Page - Winbond

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ISD1700A SERIES
Confidential
Publication Release Date: March 28, 2005
- 27 -
Revision A0
Example #2:
ISD1740A
ISD1750A
ISD1760A
R
OSC
V
CCA
V
SSA
V
CCP
V
SSP1
AUD
RDY
ERASE
PLAY
REC
AGC
V
SSP2
V
SSD
V
CCD
RESET
FT
ANA IN
MIC -
MIC+
NC
TE1
TE2
TE3
FWD
VOL
4.7 F
µ
V
CCP
V
CCA
0.1 F
µ
0.1 F
µ
0.1 F
µ
LED
1 K
V
CCD
C9 *
C5
C10 *
C6
C4
C8 *
C1
R1
D1
S1
S2
S3
S4
S5
S6
24
23
25
26
19
3
10
11
20
18
2
1
28
21
8
14
16
12
15
13
17
27
22
9
7
6
5
4
0.1 F
C7
µ
C11 *
V
CC
R2 **
V
CCA
V
CCD
V
CCP
0.1 F
µ
C2
Vcc
***
390
0.1 F
µ
V
CC
Q1
8050C
Speaker
Optional: based upon the applications
SP+
SP-
Speaker
or Buzzer
vAlert
***
Vcc
Gnd
S7
Recording via AnaIn input
Notes:
* These capacitors may be needed in order to optimize for the best voice quality, which is also dependent
upon the layout of the PCB. Depending on system requirement, they can be 10
µF, 4.7 µF or other values.
Please refer to ChipCorder Applications section or consult Winbond for layout advice.
** For Sampling Freq at 8 kHz, R2 = 80 KΩ
*** It is important to have a separate path for each ground and power back to the related terminal to minimize
the noise. Also, the power supplies should be decoupled as close to the device as possible.
11.1 GOOD AUDIO DESIGN PRACTICES
To ensure the highest quality of voice reproduction, it is important to follow good audio design
practices in layout and power supply decoupling. See Application Information or links below for
details.
Good Audio Design Practices
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf
Single-Chip Board Layout Diagrams
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf


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