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TDA2P-ABZ データシート(PDF) 9 Page - Texas Instruments

部品番号 TDA2P-ABZ
部品情報  Applications Processor 23mm Package (ABZ Package) Silicon Revision 1.0
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TDA2P-ABZ データシート(HTML) 9 Page - Texas Instruments

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TDA2P-ABZ
www.ti.com
SPRS990F – DECEMBER 2016 – REVISED DECEMBER 2018
Submit Documentation Feedback
Product Folder Links: TDA2P-ABZ
Terminal Configuration and Functions
Copyright © 2016–2018, Texas Instruments Incorporated
4
Terminal Configuration and Functions
4.1
Pin Diagram
Figure 4-1 shows the ball locations for the 760 plastic ball grid array (PBGA) package and are used in
conjunction with Table 4-1 through Table 4-27 to locate signal names and ball grid numbers.
Figure 4-1. ABZ S-PBGA-N760 Package (Bottom View)
NOTE
The following bottom balls are not connected: AF7 / AF10 / AF13 / AF16 / AF19 / AE4 /
AE25 / AB26 / W3 / W26 / T3 / T26 / N3 / N26 / K3 / K26 / G3 / D4 / D25 / C10 / C13 / C16 /
C19 / C22.
These balls do not exist on the package.
4.2
Pin Attributes
Table 4-1 describes the terminal characteristics and the signals multiplexed on each ball. The following list
describes the table column headers:
1. BALL NUMBER: Ball number(s) on the bottom side associated with each signal on the bottom.
2. BALL NAME: Mechanical name from package device (name is taken from muxmode 0).
3. SIGNAL NAME: Names of signals multiplexed on each ball (also notice that the name of the ball is the
signal name in muxmode 0).
NOTE
Table 4-1 does not take into account the subsystem multiplexing signals. The subsystem
multiplexing signals are described in Section 4.3, Signal Descriptions.
NOTE
In the Driver off mode, the buffer is configured in high-impedance.
4. PHxx: This column shows if the functionality is applicable for TDA2PHxx devices.
Note that the Pin Attributes table presents the functionality of TDA2PSxx device.
PHxx - TDA2PHGx; TDA2PHFx; TDA2PHVx; TDA2PHAx;


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