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TMP141 データシート(PDF) 7 Page - Texas Instruments |
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TMP141 データシート(HTML) 7 Page - Texas Instruments |
7 / 19 page TMP141 SBAS347 − MARCH 2005 www.ti.com 7 OVERVIEW The TMP141 is a digital output temperature sensor that uses the single-wire SensorPath interface protocol. It does not require any external sensing components for measuring temperature. In order to minimize circuit board space, the TMP141 is offered in the MSOP-8 and SOT23-6 packages. The primary usage of SensorPath-based systems is for systems that monitor hardware health. The predefined SensorPath functions are: temperature measurement, voltage measurement, and non-volatile memory. The specification allows for expansion by defining new functions or enlarging upon the predefined functions. The TMP141 implements the temperature measurement function with a resolution of 0.25 °C. The SensorPath interface allows a master to read up to seven slave devices on a bus, four of which can be TMP141s. The master interrogates devices on the bus to determine what they are, their capabilities, and how they can be used. Devices on the Single-Wire Data (SWD) bus are open drain. Therefore, the SWD bus requires a 1.25k Ω pull-up resistor on the bus. This resistor may be provided by the master. If the pull-up resistor is not included within the master, an external resistor must be attached to the bus. A 0.1 µF capacitor is recommended for power-supply bypassing, as shown in Figure 3. Registers inside each device include information that identifies the device capabilities, manufacturer, part ID, and even device revision number. TMP141 Master Optional R = 1.25k Ω SWD ADD1 ADD0 V S =3.3V 0.1 µF V SS The resistor R may be integrated into the master. Figure 3. Typical Connections of the TMP141 TEMPERATURE SENSING AND CONVERSION The TMP141 senses the absolute temperature by utilizing a diode which is part of the IC. Therefore, the sensing device of the TMP141 is the chip itself. Thermal paths run through the package leads as well as the plastic package, and the lower thermal resistance of metal causes the leads to provide the primary thermal path. To maintain accuracy in applications that require air or surface temperature measurement, care should be taken that the package and leads thermally connect with the surface where the temperature measurement is desired. For example, a thermally-conductive adhesive assists in achieving accurate surface temperature measurements. Even without special precautions, because of the very low power consumption of the TMP141, self-heating will normally be well below 1LSB (0.25 °C). TYPICAL APPLICATION The TMP141 is normally used with the address pins wired high or low to select one of four possible addresses. The value read from the hardware pins plus one is stored in register 0 as the device number. When the master transmits a matching device number, the TMP141 will respond. In the example shown in Figure 3, ADD1:ADD0 are wired to 2h. In this example, 3h will be stored in register 0. When the master addresses device number 3, the TMP141 in Figure 3 will respond. The TMP141 will also work well in applications where ADD0:ADD1 are driven by logic levels since it reads these pins every time it does a conversion or bus transaction (see Table 2). |
同様の部品番号 - TMP141 |
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同様の説明 - TMP141 |
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